Description
HSL-6002 is professionally designed for the determination of heat sealability of various kinds cup cover films of yogurt cups, instant noodles, capsule coffee cups, jelly cups etc. Heat sealability of film depends on heat seal temperature, heat seal pressure and heat dwell time.
Application Content
HSL-6002 is professionally designed for the determination of heat sealability of various kinds cup cover films of yogurt cups, instant noodles, capsule coffee cups, jelly cups etc. Heat sealability of film depends on heat seal temperature, heat seal pressure and heat dwell time.
Technical Indexes Content
Heat temperature: Room temperature+6 – 300℃
Accuracy: ±0.2 ℃
Dell time: 0.1- 999.9s
Pressure: 0.05 MPa-1.0MPa
Max cover film area: 265mm × 90 mm
Cup frame: 280mm × 145 mm × 105 mm (customized available)
Cup model: 66mm, 63mm, 58 mm (customized available)
Gas source pressure: 0.05MPa – 1.0MPa (self-provide)
Gas source interface: Ф6mm
Outer dimension: 570 mm (L)×500 mm (W)×470 mm (H)
Work noise: 0db
Power supply: AC 220V 50Hz
Net weight: 63kg
Standards Content
QB/T 2358(ZBY 28004), ASTM F2029, YBB 00122003
Configuration Content
Standard Configuration
main unit, micro-printer, footswitch
Optional
Customized cup frame, Film clip, Communication cable, DSM system